台积电硅光子技压英特尔

爱集微

09/04

台积电强攻硅光子技术，技压英特尔。日媒披露，台积电在美国最新硅光子申请专利数量较英特尔多近一倍。硅光子是英伟达下一代AI服务器高速传输必备技术，台积电重兵部署，打造强大专利能量，集结旗下封装大厂采钰大进击，技压群雄，抢攻AI大商机。台积电大客户英伟达是推动硅光子技术导入商品化的关键动能。英伟达日前于“HotChips 2025”大会上，首次展示采用共封装光学（CPO）元件的Spectrum-X...

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href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250904071110977637d5&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"NVDS","symbol_name":"Tradr 1.5X Short NVDA Daily ETF","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250904071110977637d5&s=b","article_id":"2564310635","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250904071110977637d5&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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3D封装，并引入硅光子与可能的CPO协同，降低电互连瓶颈与功耗。台积电积极投入硅光子研究，之前于2025年北美技术论坛中，强调硅光子技术的整合进展，特别是其研发的紧凑型通用光子引擎（COUPE）技术，通过将电子裸晶堆叠在光子裸晶之上，以应对AI发展带来的数据传输爆炸性增长。台积电规划，将于2025年完成COUPE验证，并于2026年整合至CoWoS封装，成为共同封装光学元件，以期通过更高性能的连结来推动AI转型。台积电并与ASIC暨高速网络芯片大厂迈威尔深化合作，锁定3nm以下制程与下一代硅光子技术，扩大进击硅光子商机。台积电也建立厚实的光通信数据库，作为后续抢市强大依靠。日媒使用知名专利情报网站Patentfield的工具后发现，台积电2024年在美国申请50件硅光子相关专利，数量比英特尔的26件多了近一倍。2023年时，台积电、英特尔硅光子专利申请数势均力敌（分别为46件、43件）。此前，英特尔硅光子相关专利申请数远超过台积电。如今台积电顺利超车，据报导，英特尔在研发上居于领先，不过在实际应用上、被台积电超越，台积电规划2026年量产使用最新CPO，反观英特尔仅止于研发／实证阶段。台积电并携手子公司采钰共同挥军硅光子商机，业界传出，双方将进一步整合硅光子、CPO等技术，有望成为采钰后续运营的另一个动能。业界分析，采钰具备晶圆级光学薄膜制程，能够往光耦合接收端与发射端的对准、光效能强化以及积体光路（PIC）芯片领域发展，同时将可利用微透镜（Metalens）增加客户光传输耦合效率。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"2","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}

台积电硅光子 技压英特尔

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台积电硅光子技压英特尔