英伟达新一代GPU有望采用碳化硅中介层，SiC衬底新应用打开公司成长空间

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09/07

晶盛机电(300316)投资要点事件：英伟达计划在新一代GPU芯片的CoWoS工艺中以碳化硅取代硅中介层，预计2027年导入。英伟达高阶GPU均采用CoWoS结构，后续高性能版本散热需求更高：英伟达GPU芯片从H100到B200均采用CoWoS封装（芯片-晶圆-基板）技术。CoWoS通过将多个芯片（如处理器、存储器等）高密度地堆叠集成在一个封装内，显著缩小了封装面积，并大幅提升了芯片系统的性能和...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250907163049951a2039&s=b><strong>东方财富</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>晶盛机电(300316)投资要点事件：英伟达计划在新一代GPU芯片的CoWoS工艺中以碳化硅取代硅中介层，预计2027年导入。英伟达高阶GPU均采用CoWoS结构，后续高性能版本散热需求更高：英伟达GPU芯片从H100到B200均采用CoWoS封装（芯片-晶圆-基板）技术。CoWoS通过将多个芯片（如处理器、存储器等）高密度地堆叠集成在一个封装内，显著缩小了封装面积，并大幅提升了芯片系统的性能和...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250907163049951a2039&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1116320737.USD","symbol_name":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A6\" (USD) 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