PDF Solutions Inc. has announced a significant multi-year contract with a major global semiconductor manufacturer. The agreement involves the deployment of PDF Solutions' eProbe tools, Characterization Vehicle infrastructure, and Exensio analytics software across several high-volume manufacturing facilities. The eProbe technology offers contactless testing of 3D semiconductor structures, optimized for each wafer's design, which will be supported by PDF Solutions' comprehensive software suite for machine optimization and results analysis. The deployment will utilize the company's secureWISE network for remote equipment support and maintenance. PDF Solutions has reaffirmed its full-year 2025 revenue growth guidance of 21% to 23% compared to 2024. This contract is seen as a validation of the company's strategy in advanced node development and high-volume manufacturing.