3M (MMM) said Tuesday it has joined Joint3, a semiconductor packaging consortium focused on panel-level organic interposers.

The group, established by Japan-based Resonac, is a co-creation platform to speed tools and designs for large organic interposers, the company said.

Joint3 is developing square designs optimized for 515 x 510 mm panel-level interposers to boost manufacturing yield versus traditional circular wafers as interposers grow and shift from silicon to organic materials, 3M said.

Additionally, the company also said the work targets packaging needs for markets such as generative AI and autonomous vehicles.