随着人工智能和先进封装推动需求，半导体代工市场将增长

电子产品世界

10/10

根据 Credence Research 的一份新报告，全球代工行业正处于稳定增长的轨道上，预计将从 2023 年的 1255.6 亿美元增长到 2032 年的 1717.0 亿美元。该公司表示，3.99% 的复合年增长率（CAGR）凸显了汽车、航空航天和工业机械等关键行业对精密金属铸造和半导体制造的需求不断增长。对于 eeNews Europe 读者来说，这一趋势标志着半导体制造、封装和...

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读者来说，这一趋势标志着半导体制造、封装和...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251010110754a6b28243&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"SG9999000418.SGD","symbol_name":"Aberdeen Standard Global Technology SGD","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251010110754a6b28243&s=b","article_id":"2574314832","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251010110754a6b28243&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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芯片组的需求正在推动代工厂提高产能并迁移到 3 纳米和 2 纳米等先进工艺节点。与此同时，代工厂正在大力投资异构集成和基于小芯片的架构，以提高人工智能工作负载的效率和灵活性。先进的封装技术——包括 3D 堆叠和 CoWoS 和 InFO 等晶圆级集成方法——也越来越受到关注，从而实现更密集、更节能的芯片设计。各国政府在重塑全球铸造格局方面发挥着重要作用。美国、中国和欧盟成员国正在提供大规模补贴，以实现半导体制造的本地化，减少对海外晶圆厂的依赖。欧洲自己的《芯片法案》旨在通过支持德国、法国和意大利的项目来加强这一战略，特别是在汽车级半导体和工业物联网应用方面。竞争和新兴机遇Credence Research 指出，由台积电、三星和格芯等主要参与者主导的竞争格局适度整合。小型代工厂继续在成熟节点和汽车和工业电子等专业市场取得成功。报告强调，成功整合数字化和可持续发展实践的代工厂可能会获得竞争优势。自动化和数字铸造技术（包括人工智能驱动的质量控制、3D 砂打印和预测性维护）正在提高产量和能源效率，同时减少浪费。随着能源成本的上升和法规的收紧，可持续发展已成为战略重点。展望未来，高性能计算、边缘人工智能和数据中心应用应该会有很多机会。符合区域激励措施并投资先进材料和数字制造的代工厂可以很好地抓住未来的增长。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}