新思科技与台积公司合作实现2D和3D设计解决方案

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新思科技近日宣布，其旗下的Ansys仿真和分析解决方案产品组合已通过台积公司认证，支持对面向台积公司最先进制造工艺（包括台积公司N3C、N3P、N2P和A16™）的芯片设计进行准确的最终验证检查。两家公司还就面向TSMC-COUPE™平台的AI辅助设计流程开展了合作。新思科技与台积公司共同赋能客户有效开展芯片设计，涵盖AI加速、高速通信和先进计算等一系列应用。多物理场和AI驱动的光子学设计支持...

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Compiler™3DIC设计探索与签核一体化平台，可用于实现分层热感知时序分析和电压感知时序分析。这样的多物理场方法，可帮助客户加速大型3DIC设计的收敛。Ansys optiSLang软件和Ansys Zemax OpticStudio软件通过AI辅助优化和灵敏度分析来缩短客户的设计周期并提高设计质量，从而改变了TSMC-COUPE™架构中的光耦合系统设计。这些工具使工程师能够集成自定义组件，例如通过Ansys Lumerical FDTD利用光子逆向设计优化的光栅耦合器。先进工艺技术认证Ansys RedHawk-SC和Ansys Totem是面向数字/模拟电源完整性的基础解决方案，可验证产品是否能够可靠运行并满足性能目标。这些解决方案有助于验证采用台积公司N3C、N3P、N2P和A16™工艺技术制造的芯片的电源完整性。同样，面向芯片电磁建模的Ansys HFSS-IC Pro解决方案也通过了台积公司N5和N3P工艺的认证。此外，新思科技还与台积公司合作，为台积公司A14工艺开发设计流程，并计划于2025年下半年发布其首款光子学设计套件。Ansys PathFinder-SC™是一款最新认证的N2P工艺静电放电电流密度（ESD CD）/点对点（P2P）电阻检查工具，可对芯片对电气过应力浪涌（冲击）的抗扰能力进行验证，为工程团队树立信心。该解决方案的独特优势在于，其具备在设计早期快速验证超大规模芯片的能力，从而加速设计流程并提高产品耐久性。并且，Ansys PathFinder-SC已具备支持复杂的3D集成电路（3DIC）和多芯片系统的能力。新思科技正在与台积公司合作扩展大规模3DIC设计分析的工具功能。▲ 双方协作实现面向台积电先进节点技术的工作流程，加速AI、高速数据通信和先进计算发展Ansys HFSS-IC Pro已通过台积公司认证，可对其先进的5nm和3nm工艺技术进行芯片级分析。此次合作使客户能够满足包括AI、HPC、5G/6G通信和汽车电子产品等复杂应用的需求。台积公司生态系统与联盟管理事业部总监Aveek 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