面对英伟达的“巨无霸”方案，AMD为何选择另辟蹊径？

电子半导体观察

10/15

点击上方蓝字关注我们当英伟达凭借其千倍级AI数据中心解决方案与持续扩张的NVLink Fusion生态系统展现技术实力时，竞争对手AMD在2025年OCP全球峰会上呈现出差异化的发展思路。AMD首席技术官兼执行副总裁马克·佩珀马斯特在题为“构建全面开放协作的AI生态系统”的演讲中强调，面对AI技术的飞速演进，开放与协作已成为不可或缺的基石。以下是AMD在开放生态建设方面的关键布局与进展。在x86...

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Fusion生态系统展现技术实力时，竞争对手AMD在2025年OCP全球峰会上呈现出差异化的发展思路。AMD首席技术官兼执行副总裁马克·佩珀马斯特在题为“构建全面开放协作的AI生态系统”的演讲中强调，面对AI技术的飞速演进，开放与协作已成为不可或缺的基石。以下是AMD在开放生态建设方面的关键布局与进展。在x86...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015204956a6bad2ac&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2543165471.USD","symbol_name":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015204956a6bad2ac&s=b","article_id":"2575787182","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015204956a6bad2ac&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description 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Fusion生态系统展现技术实力时，竞争对手AMD在2025年OCP全球峰会上呈现出差异化的发展思路。AMD首席技术官兼执行副总裁马克·佩珀马斯特在题为“构建全面开放协作的AI生态系统”的演讲中强调，面对AI技术的飞速演进，开放与协作已成为不可或缺的基石。以下是AMD在开放生态建设方面的关键布局与进展。在x86架构演进与行业合作方面，10月13日标志着AMD与英特尔主导的x86顾问小组成立满一周年。佩珀马斯特透露，两家公司与超大规模云服务商、设备制造商及操作系统领军企业协同推进，在中断模型架构、面向向量与矩阵运算的指令集扩展以及内存安全功能等领域实现了重要技术统一。他指出，英伟达与英特尔近期的合作印证了x86生态的规模优势，而AI顾问小组正通过推动代码通用性，有效防范不同供应商之间的技术碎片化。围绕开放协作理念，佩珀马斯特阐释了技术发展的历史规律：从Linux开启现代软件时代，到TCP/IP、HTTP等标准协议驱动网络革命，每次产业突破都植根于开放土壤。他强调，AI技术浪潮同样需要开放生态系统支撑，这正是开放计算项目（OCP）的核心价值所在。值得关注的是，AMD在峰会期间宣布加入纵向扩展网络以太网联盟（ESUN）。该联盟致力于建立通用抽象层，使系统设计者能够在保持以太网基础设施的基础上，灵活选用最适合的传输协议。这一举措将推动以太网生态向更健壮、多元的方向发展。在开放软件战略层面，AMD的ROCm开放软件栈与多项互联技术共同构成了AI生态的支撑体系。其中UCIe标准实现小芯片互联，CXL负责硬件扩展，UA Link专注纵向扩展，UEC则支撑横向扩展需求。值得一提的是，将于2026年迎来十周年的ROCm软件栈，已从最初面向高性能计算的原型系统，演进为支撑全球顶级超级计算机的生产级解决方案。面向基础设施架构，AMD在机架级系统中同步推进纵向扩展与横向扩展技术路线。作为超以太网联盟（UEC）创始成员，公司正通过拥堵管理、分组喷洒等技术强化以太网的横向扩展能力。同时作为UA Link联盟创始成员，AMD贡献了经过实践验证的Infinity Fabric知识产权，加速该标准在行业内的普及。在实际应用层面，AMD为纵向扩展提供两种实现路径：原生UA Link专为GPU直连优化（配套交换机正在开发中），以及基于以太网传输的UA Link标准方案。这种灵活架构在Helios机柜系统中得到充分体现——通过融合OCP、DC-SCM、NHS、UA Link等开放标准，实现了模块化设计与跨组件互操作性。单个托盘内集成PCIe 6.0外设连接、CXL扩展接口、Infinity FabricCPU-GPU互联、基于UA Link的AI网络通道以及以太网纵向扩展功能，最终由DC-SCM管理模块完成整体架构整合。扫码关注我们电子半导体观察了解更多相关资讯","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}