Xiamen Hengkun New Materials Technology (SHA:688727) is looking to issue up to nearly 67.4 million shares in an initial public offering on the Shanghai Stock Exchange, according to a prospectus filed with the bourse Thursday.

The semiconductor advanced materials manufacturer's shares on offer will constitute 15% of the entire share capital following the issuance, the filing said.

After the completion of the IPO, Hengkun will have 449.3 million shares in issue.

CITIC Securities (HKG:6030, SHA:600030) is the sponsor while Zhongtai Securities (SHA:600918) is the joint lead underwriter.