苹果这款芯片，全面取代高通

半导体芯闻

10/29

如果您希望可以时常见面，欢迎标星收藏哦~来源：内容来自半导体芯闻综合。据报道，iPhone 17 系列将成为苹果最后一代搭载高通 5G 基带芯片的机型。苹果正计划在 iPhone 18 全系上全面切换至自研的 C2 基带芯片。这一自研方案在 iPhone 16e 发布后不久即开始研发，预计将在 2026 年实现量产。不过，最新消息显示，与苹果自研的 A20、A20 Pro 等芯片不同，C2 并...

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href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251029190011a6d4b062&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2083900584.USD","symbol_name":"HSBC GIF US INCOME FOCUSED \"AM2\" (USD) INC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251029190011a6d4b062&s=b","article_id":"2579972724","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251029190011a6d4b062&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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5G 调制解调器将使用台积电4nm“N4”工艺量产。此前有分析师指出，对于这类芯片而言，并没有强烈动力去采用最新一代制程。尽管苹果 reportedly 已锁定了台积电超过一半的首批 2nm 产能，但该制程并不会用于 C2 基带芯片。据《工商时报》报道，苹果将继续采用 4nm N4 工艺打造下一代基带产品。值得注意的是，当前 iPhone 16e 所使用的 C1 基带芯片也是基于 4nm 工艺，这表明在该类别中，苹果并不急于转向最新 2nm 节点。除成本因素外，苹果似乎几乎没有理由为 C2 切换至 3nm 或 2nm 工艺。作为一家市值数万亿美元的科技巨头，苹果并不受限于制造成本，但分析师指出，从性能角度来看，这一转变意义有限。天风国际证券分析师郭明𫓹此前表示，基带芯片并非智能手机中最耗能的元件，而且自研基带的投资回报率并不高，采用更先进的制程也不一定能显著提升传输速率。不过，C2 相较 C1 与 C1X 的一大优势在于，它将支持毫米波（mmWave）与 Sub-6GHz 双模 5G 网络，这一差异预计将带来显著的网络速率提升。预计包括折叠屏版 iPhone 在内的 iPhone 18 全系列机型都将搭载 C2 基带芯片。考虑到 C1X 已经带来的性能改进，苹果如何在一年内再次提升体验，值得关注。至于台积电的 N4 工艺，相较上一代 N5 节点，其性能提升约 5%，晶体管密度增加约 6%。点这里 加关注，锁定更多原创内容","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"2","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}