大众汽车与地平线联合开发700TOPS智能驾驶芯片！

汽车产业前线观察

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2024 年，大众在中国市场的年销量定格在 275 万辆，较 2018 年 400 万辆的峰值缩水近三成；更刺眼的是，2023 年它还把 “中国最畅销汽车品牌” 的头衔拱手让给了比亚迪。就在外界质疑这个德国巨头是否失速时，大众突然扔出重磅消息：与地平线机器人的合资公司 Carizon，要开发集团首款自研智能驾驶芯片，单芯片算力直奔 700TOPS。这分明是一场瞄准智能驾驶赛道的 “绝地反击”。一、...

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USD","LU0314109678.HKD":"MANULIFE GF DRAGON GROWTH \"AA\" (HKD) INC","LU1861214812.USD":"Blackrock Future of Transport A2 USD","LU0594300419.USD":"富达中国消费基金A","LU0828238088.HKD":"SCHRODER ISF GLBL EMGNG MKT OPPS \"A\" (HKD) ACC"},"translate_title":"Volkswagen and Horizon jointly develop 700TOPS intelligent driving chip!","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"81211":0.6,"09660":0.9,"09868":0.9,"00285":0.62,"002594":0.6,"BYDDY":0.6,"HYDD.SI":0.6},"content_text":"2024 年，大众在中国市场的年销量定格在 275 万辆，较 2018 年 400 万辆的峰值缩水近三成；更刺眼的是，2023 年它还把 “中国最畅销汽车品牌” 的头衔拱手让给了比亚迪。就在外界质疑这个德国巨头是否失速时，大众突然扔出重磅消息：与地平线机器人的合资公司 Carizon，要开发集团首款自研智能驾驶芯片，单芯片算力直奔 700TOPS。这分明是一场瞄准智能驾驶赛道的 “绝地反击”。一、销量腰斩丢冠：大众的中国 “生死局”大众的焦虑并非空穴来风。过去五年，比亚迪靠着高性价比的纯电与插混车型一路狂奔，甚至将高阶智驾下放到 10 万元级车型，而大众一度陷入 “电动化慢半拍、智能化跟不上” 的尴尬。智能驾驶已成为中国消费者购车的核心考量，而芯片正是智能驾驶的 “大脑”—— 没有自主可控的高算力芯片，再花哨的智驾宣传都是空中楼阁。此前大众的智能驾驶芯片多依赖外部供应，不仅成本高，还难以快速匹配中国复杂的路况需求。眼看比亚迪联合地平线将智驾功能铺向百万级车型，大众终于下定决心：必须攥紧芯片这个 “命门”。Cariad 中国区 CEO 韩慕谦直言，此举是为了深化 “在中国、为中国” 的研发能力，说白了，就是要在对手的主场抢回主动权。二、700TOPS 芯片藏玄机：算力碾压特斯拉，瞄准 L4 级智驾大众这次亮出的芯片，硬实力确实够硬核。单芯片 500-700TOPS 的算力是什么概念？要知道特斯拉 FSD 芯片算力仅 144TOPS，而 L3 级以上自动驾驶至少需要 500TOPS 算力支撑。这意味着大众的新芯片能同时处理十几路摄像头、激光雷达的数据，不仅能识别行人车辆，还能预判路况变化，为 L4 级自动驾驶铺路。更关键的是，这款芯片采用 3-4 纳米顶尖制程，这是目前汽车芯片的最高水准，能在提升算力的同时降低功耗。不过韩慕谦也坦言，能量产这种芯片的晶圆代工厂 “选择十分有限”，这意味着大众既要攻克技术难关，还要搞定供应链难题。这款芯片并非孤立存在，它将嵌入大众第三代 “中国电子架构”（CEA）中。这个与小鹏联合开发的架构堪称 “智能汽车中枢”，能减少 30% 的电子控制单元，还支持整车 OTA 升级。按照计划，今年搭载地平线 J 系列芯片的 CEA 架构车型就会上市，到 2030 年，80% 的在华大众汽车都将基于该架构打造。三、不止芯片：大众的 “中国自救组合拳”自研芯片只是大众自救的一步棋，它还布下了更大的局。早在芯片消息之前，大众就扩大了与小鹏的合作，从联合开发车型升级到共建电子架构，甚至把 CEA 架构的应用范围从电动车拓展到燃油车，要实现 “油电同智”。这招相当精明 —— 既能借助小鹏的本土化软件能力快速补短板，又能通过架构复用降低成本。大众的算盘很清晰：以 CEA 架构为骨架，用自研芯片当大脑，再靠本土化合作填细节。毕竟中国市场的竞争早已不是 “机械素质” 的比拼，而是 “软件定义汽车” 的较量。比亚迪能崛起，靠的就是从芯片到架构的垂直整合能力，如今大众正沿着相似的路径追赶。不过挑战依然严峻：比亚迪已联合地平线实现智驾芯片规模化量产，旗下百万级车型都搭载了相关技术；而大众的自研芯片还在研发阶段，量产落地至少需要 3-5 年。但对大众而言，这已是不得不走的路 —— 在失去销量冠军后，智能驾驶成了它收复失地的最后机会。结语：芯片战能改写战局吗？从销量腰斩到联手地平线押注芯片，大众的转型决心显而易见。700TOPS 的算力、3-4 纳米的制程、CEA 架构的支撑，这套组合拳确实展现了巨头的底蕴。但中国市场的节奏从不等慢半拍，比亚迪们早已在智驾赛道拉开差距。这场芯片战，本质是大众用 “本土化研发” 对抗本土对手的 “本土化优势”。如果能如期实现量产，大众或许能在 2030 年前重获竞争力；但如果卡在技术或供应链上，错过的可能不只是市场份额，更是整个智能汽车时代的入场券。大众的反击战，才刚刚打响。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}