Schmid Group Secures Major Orders for Panel Level Packaging and mSAP Production Equipment

Reuters

2025/11/10

Schmid Group Secures Major Orders for Panel Level Packaging and mSAP Production Equipment

Schmid Group NV has announced the successful completion of two major orders in the rapidly growing sectors of Panel Level Packaging (PLP) and modified Semi-Additive Process (mSAP) technology. The company, a global manufacturer and solutions provider for printed circuit board $(PCB)$ and IC substrate production, stated that these orders highlight its role in enabling advanced electronics manufacturing amid increasing demand driven by artificial intelligence $(AI)$ and semiconductor industry growth. According to industry sources cited by Schmid Group, the demand for large-format substrates is rising, with new designs incorporating more High-Bandwidth Memory $(HBM)$ stacks and Co-Packaged Optics (CPO) solutions. The company's advanced process equipment portfolio aims to support scalable and high-yield manufacturing for next-generation packaging technologies.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Schmid Group NV published the original content used to generate this news brief on November 10, 2025, and is solely responsible for the information contained therein.

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The company, a global manufacturer and solutions provider for printed circuit board <a href=\"https://laohu8.com/S/PCB\">$(PCB)$</a> and IC substrate production, stated that these orders highlight its role in enabling advanced electronics manufacturing amid increasing demand driven by artificial intelligence <a href=\"https://laohu8.com/S/AI\">$(AI)$</a> and semiconductor industry growth. According to industry sources cited by Schmid Group, the demand for large-format substrates is rising, with new designs incorporating more High-Bandwidth Memory <a href=\"https://laohu8.com/S/HBM\">$(HBM)$</a> stacks and Co-Packaged Optics (CPO) solutions. The company's advanced process equipment portfolio aims to support scalable and high-yield manufacturing for next-generation packaging technologies.\n      </p>\n</div><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<em>Disclaimer: <span>This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Schmid Group NV published the original content used to generate this news brief on November 10, 2025, and is solely responsible for the information contained therein.</span></em>\n</div></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"SHMD","symbol_name":"SCHMID GROUP N.V.","start_time":0,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20251110:nNDL3WDyCB:1","article_id":"2582269688","we_media_id":"1032215980","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2582269688","pubTimestamp":1762765194,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Reuters","introduction":"Reuters.com brings you the latest news from around the world, covering breaking news in markets, business, politics, entertainment and technology","home_visible":1,"id":"1032215980","head_image":"https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48"},"summary":"Schmid Group NV has announced the successful completion of two major orders in the rapidly growing sectors of Panel Level Packaging  and modified Semi-Additive Process  technology. The company, a global manufacturer and solutions provider for printed circuit board  and IC substrate production, stated that these orders highlight its role in enabling advanced electronics manufacturing amid increasing demand driven by artificial intelligence  and semiconductor industry growth. According to industry sources cited by Schmid Group, the demand for large-format substrates is rising, with new designs incorporating more High-Bandwidth Memory  stacks and Co-Packaged Optics  solutions. The company's advanced process equipment portfolio aims to support scalable and high-yield manufacturing for next-generation packaging technologies.Disclaimer: This news brief was created by Public Technologies  using generative artificial intelligence. 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According to industry sources cited by Schmid Group, the demand for large-format substrates is rising, with new designs incorporating more High-Bandwidth Memory $(HBM)$ stacks and Co-Packaged Optics (CPO) solutions. The company's advanced process equipment portfolio aims to support scalable and high-yield manufacturing for next-generation packaging technologies.\n      \n\nDisclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. 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