台积电不再是唯一：苹果、高通评估Intel先进封装替代

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快科技11月17日消息，随着全球对AI和高性能计算芯片需求的增长，先进封装技术的需求持续升温，市场对台积电CoWoS产线的依赖也达到了高峰。由于台积电的CoWoS产能目前主要被NVIDIA、AMD以及大型云端客户承包，留给新客户的排程弹性和空间非常有限。这使得其他芯片大厂不得不开始积极评估并布局多元化的封装路线，包括苹果和高通在内的多家科技巨头，正积极在其新招聘的职缺中明确要求具备Intel ...

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href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251117163738a6fee860&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"IE00BZ1G4Q59.USD","symbol_name":"LEGG MASON CLEARBRIDGE US EQUITY SUSTAINABILITY LEADER \"A\"(USD) INC (A)","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251117163738a6fee860&s=b","article_id":"2584643350","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251117163738a6fee860&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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CEO及高层过去曾多次强调，自家的Foveros和EMIB技术已吸引了多家客户的兴趣，并具备大规模量产的能力。其中EMIB属于2.5D封装，采用嵌入式硅桥连接多颗芯片，实现水平整合，无需大型硅中介层，具备成本较低和散热优良的优点。Foveros属于3D垂直堆叠封装，通过硅通孔（TSV）进行异质垂直堆叠，适合混合不同制程的芯片，具有高密度和省电的特性，Meteor Lake、Arrow Lake与Lunar Lake均采用了此项技术。而台积电的CoWoS则属于2.5D大型硅中介层封装，是目前支持最多颗HBM堆叠的解决方案，也是AI GPU最主要采用的市场主流技术，优势在于成熟度高、产线规模大。市场人士指出，苹果和高通此次明确点名Intel技术，被视为产业开始走向多元化布局的信号，也预示着未来先进封装可能从单一依赖CoWoS，逐渐走向“双供应模式”。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}