美光：明年HBM3E和HBM4已售罄；长鑫存储发布最新DDR5产品；AMD苏姿丰：AI投资不足比投资过多更危险

闪存市场

2025/11/24

【热点速读】1、美光：明年HBM3E和HBM4已售罄，Q2开始出货HBM42、最高速率达8000Mbps！长鑫存储发布最新DDR5产品系列3、中科飞测首台晶圆平坦度测量设备已出货，交付至HBM领域客户4、AMD苏姿丰：不担心 AI 泡沫，投资不足比投资过多更危险5、CXL 4.0 规范发布：基于 PCIe 7.0，数据传输速率达128GT/s1、美光：明年HBM3E和HBM4已售罄，Q2开始出货...

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12:04","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2585458042","market":"us","top_or_hot":-1,"title":"美光：明年HBM3E和HBM4已售罄；长鑫存储发布最新DDR5产品；AMD苏姿丰：AI投资不足比投资过多更危险","media":"闪存市场","content":"<div>\n<p>【热点速读】1、美光：明年HBM3E和HBM4已售罄，Q2开始出货HBM42、最高速率达8000Mbps！长鑫存储发布最新DDR5产品系列3、中科飞测首台晶圆平坦度测量设备已出货，交付至HBM领域客户4、AMD苏姿丰：不担心 AI 泡沫，投资不足比投资过多更危险5、CXL 4.0 规范发布：基于 PCIe 7.0，数据传输速率达128GT/s1、美光：明年HBM3E和HBM4已售罄，Q2开始出货...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251124133731a4b64ae0&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>美光：明年HBM3E和HBM4已售罄；长鑫存储发布最新DDR5产品；AMD苏姿丰：AI投资不足比投资过多更危险</title>\n<style 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7.0，数据传输速率达128GT/s1、美光：明年HBM3E和HBM4已售罄，Q2开始出货...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251124133731a4b64ae0&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"GFS","symbol_name":"GLOBALFOUNDRIES Inc.","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251124133731a4b64ae0&s=b","article_id":"2585458042","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251124133731a4b64ae0&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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Gbps，正在按照既定程序接受评估。据了解，SK海力士在台积电代工生产HBM4基片，三星电子HBM4基片交由三星晶圆代工生产，而美光则选择自主设计和生产。美光CTO 斯科特·德博尔驳斥了外界关于其HBM4基片落后于竞争对手的观点。他表示，基片与ASIC不同，其所有设计均专注于内存优化。由于去年各家代工厂尚未准备好相关优化方案，因此美光决定自主生产。他同时透露，从HBM4E开始，美光HBM基片将交由台积电进行生产，目前双方正在共同推进开发工作。斯科特·德博尔表示，美光HBM4的开发策略是尽可能沿用HBM3E的工艺、设计和检测流程，预计实现成熟良率的速度将显著快于前代产品，将推动成本结构优化与利润空间扩张。2、最高速率达8000Mbps！长鑫存储发布最新DDR5产品系列近日，长鑫存储首次全面展示DDR5和LPDDR5X两大产品线最新产品。长鑫存储最新的DDR5产品系列最高速率达8000Mbps，最高颗粒容量24Gb，并推出UDIMM、SODIMM、CUDIMM、CSODIMM、RDIMM、MRDIMM、TFF MRDIMM等七大模组及新型产品，覆盖服务器、工作站及个人电脑等全场景领域，满足各领域的高端市场需求。长鑫存储LPDDR5X产品针移动市场旗舰产品，最高速率10667Mbps，最高颗粒容量16Gb，并涵盖12GB、16GB、24GB、32GB 等容量的多种封装解决方案。3、中科飞测首台晶圆平坦度测量设备已出货，交付至HBM领域客户“中科飞测”公众号发文称，该司首台晶圆平坦度测量设备GINKGOIFM-P300已正式出货，交付至HBM领域客户。该设备专为图案化与非图案化晶圆的高精度几何与纳米形貌检测而设计，可对多种晶圆进行高精度量测。官方资料显示，GINKGOIFM-P300基于该司成熟的量测平台打造，融合创新硬件系统与智能算法，为IC制造商提供从研发到量产全流程的晶圆质量监控方案。该设备广泛适配≥96层3D NAND、≤1Xnm逻辑芯片、DRAM及HBM等先进制程。该设备具备多维度指标检测能力，覆盖翘曲、弓形、纳米形貌、平面内位移、局部曲率等参数，并能同步捕捉晶圆厚度变化与边缘滚降特征。4、AMD苏姿丰：不担心 AI 泡沫，投资不足比投资过多更危险据外媒报道，AMD CEO苏姿丰日前在接受采访时表示，“我不担心人工智能泡沫，我确实认为那些持这种想法的人有点过于短视了。他们并没有真正看到这项技术的力量。”苏姿丰表示，那些愿意下“大胆且果敢的赌注”的人正在收获回报，包括股价飙升和市场份额增加，并且她认为科技公司对人工智能应用的探索才刚刚起步。苏姿丰强调，对算力的需求是“永无止境的”。随着AI市场不断成长，她相信那些能够提供最优、最可靠AI基础设施的公司将迎来蓬勃发展——这正是她战略思考的核心所在。此外，她还表示，在她看来，投资不足比投资过多危险得多。她预测，到2030年，AI与数据中心运算市场的规模将达到每年1万亿美元。5、CXL 4.0 规范发布：基于 PCIe 7.0，数据传输速率达128GT/s近日，CXL联盟发布CXL 4.0 规范。该版本以PCIe 7.0为基础，数据传输速率达 128GT/s，吞吐能力相比前代翻倍。除速率的提升外，CXL 4.0 还在系统架构和拓扑方面提供了更高的灵活性，其支持原生 ×2 宽度、支持最多 4 个重定时器 (Retimer)、允许多个上游端口聚合捆绑为一个逻辑实体；此外其拥有更强的内存可靠性和可维护性，能满足下一代数据密集型应用的需求。最新推荐阅读：三星电子公布最新人事调整；南亚科技大幅上修bit growth预估英伟达：营收创新高，云端GPU已售罄；联想：已签订最优合约，确保足够的存储供应；高通骁龙X2 NPU算力达80TOPSCFM：Flash Wafer价格全面上调，1Tb TLC涨至13美元多数存储成品现货价格再度拉升，涨价潮引发的多米诺效应持续显现！三星重返第一，3Q25 DRAM/NAND 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