Weihai City Commercial Bank Issues RMB1 Billion Sci-Tech Innovation Bonds
Weihai City Commercial Bank Co. Ltd. has announced the successful completion of its "2025 Sci-tech Innovation Bonds" issuance in the national inter-bank bond market. The offering involved the issuance of RMB1 billion in bonds, carrying a coupon rate of 1.94%. The bonds include an issuer's conditional redemption right at the end of the fifth year. Proceeds from the issuance, after deducting related expenses, will be used specifically to support sci-tech innovation businesses. This update follows the initial announcement of the proposed mandate to issue finance bonds earlier in the year.
Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Weihai City Commercial Bank Co. Ltd. published the original content used to generate this news brief via IIS, the Issuer Information Service operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20251202-11939753), on December 02, 2025, and is solely responsible for the information contained therein.
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