Hi Sun Technology (China) Limited has announced the establishment of Phase 2 of its asset-backed securities (ABS) scheme. The ABS, backed by factoring loan receivables repaid via electronic debt instruments, were issued in the People's Republic of China with a total issue size of RMB151,000,000. The securities are structured into priority and subordinated tranches based on risk, earnings, and duration. This update follows the company's initial announcement made on 16 April 2025 regarding the ABS Scheme.
Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Hi Sun Technology (China) Limited published the original content used to generate this news brief via IIS, the Issuer Information Service operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20251216-11957471), on December 16, 2025, and is solely responsible for the information contained therein.