SK海力士赴美建2.5D封装厂：投资38.7亿美元，预计2028年投产

芯智讯

2025/12/29

12月29日消息，据韩国媒体ZDNet Korea报导，韩国存储芯片大厂SK海力士（SK hynix）正在采取一项具备战略意义的重大投资，计划在美国印第安纳州西拉法叶（West Lafayette）建立其首条2.5D 先进封装量产线。据介绍，这座先进封装工厂是SK海力士在美国境内的首座生产基地，定位为AI内存专用的最先进封装生产基地，总投资额约为38.7亿美元，目标是在2028年下半年正式投入营运...

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先进封装量产线。据介绍，这座先进封装工厂是SK海力士在美国境内的首座生产基地，定位为AI内存专用的最先进封装生产基地，总投资额约为38.7亿美元，目标是在2028年下半年正式投入营运...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251229132417a484a4a3&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1861127337.USD","symbol_name":"ALLIANZ GLOBAL MULTI ASSET SUSTAINABILITY BALANCED \"AMG\" (USD) INC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251229132417a484a4a3&s=b","article_id":"2595201116","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251229132417a484a4a3&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, 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ETF-GraniteShares"},"translate_title":"SK Hynix goes to the United States to build a 2.5 D packaging plant: investment of US $3.87 billion, expected to be put into production in 2028","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVD2.UK":0.6,"NVDU":0.6,"NVDD":0.6,"3NVD.UK":0.6,"NVIW.SI":0.6,"NVDY":0.6,"TSM":0.9,"SNVD.UK":0.6,"AI":0.79,"NVD3.UK":0.6,"2NVD.UK":0.6,"NVD":0.6,"NVDS.UK":0.6,"HBM":0.9,"NVDS":0.6},"content_text":"12月29日消息，据韩国媒体ZDNet Korea报导，韩国存储芯片大厂SK海力士（SK hynix）正在采取一项具备战略意义的重大投资，计划在美国印第安纳州西拉法叶（West Lafayette）建立其首条2.5D 先进封装量产线。据介绍，这座先进封装工厂是SK海力士在美国境内的首座生产基地，定位为AI内存专用的最先进封装生产基地，总投资额约为38.7亿美元，目标是在2028年下半年正式投入营运。目前，2.5D 封装技术被视为整合HBM 与高性能系统半导体（如GPU 或CPU）的核心制程之一。其技术原理是在半导体芯片与电路板（Substrate）之间插入一层被称为“硅中介层”（Silicon Interposer）。而这项技术具备透过硅中介层缩短芯片间的传输距离，大幅优化电力消耗与数据处理速度，以提升性能与电力效率的优势。尤其，目前全球AI 芯片大厂英伟达（NVIDIA）的高性能AI 加速器，便是通过2.5D 封装技术将HBM 与高性能GPU/CPU 紧密整合而成，更显示出相关市场潜质。SK海力士认为，若能掌握2.5D 封装的量产能力，将能全面强化其在AI 半导体封装领域的竞争力，而不仅仅局限于HBM 的生产。现阶段，SK海力士虽然在韩国国内具备2.5D 封装的基本技术力与研发设备，但仍不足以支撑能对应大型系统级封装（SiP）的量产需求。因此，报导引用消息人士的说法指出，由于现有设施难以负荷整合了HBM 的大规模AI 加速器生产，因此SK海力士正积极与封装合作伙伴商讨，在美国西拉法叶工厂建立正式的量产线。报导强调，SK海力士预计此次投资将带来诸多优势：确保供应稳定性：HBM 在交付最终客户（如英伟达）前，必须通过2.5D 封装的质量测试（Qual Test）。在现有构架下，即使HBM 本身没有问题，若在封装过程中发生不良，将导致整个交货时间延误。厘清责任归属：2.5D 封装构造复杂，一旦出现不良品，往往难以精确判定责任归属于内存厂商或封装厂。挑战台积电的垄断地位：目前AI 加速器所需的2.5D 封装市场事实上由台积电（TSMC）独占。SK海力士若能成功建立量产线，将能向客户提供HBM 与封装一站式的统包（Turn-Key）服务，提升议价能力与市场占比。半导体业界分析人士指出，SK海力士已将“具备自有的2.5D 封装设备”视为极其重要的战略课题。一旦技术趋于稳定且高度化，SK海力士将不满足于单纯的内部研发，而是会正式以此做为一项独立业务进军市场。另外，SK海力士赴美国设立先进封装厂的投资计划，不仅是为了应对英伟达等大客户的需求，更是为了在未来新一代HBM 竞争中抢占先机。随着该先进封装厂2028年完工，全球AI 半导体供应链预计将迎来一场剧烈的权力重组，而SK海力士正试图从一名强力的组件供应商，进化为掌握核心整合技术的产业关键节点，。编辑：芯智讯-林子","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"}}}