MUMBAI, Jan 28 (Reuters) - India's Summit Digitel Infrastructure plans to raise up to 7 billion rupees ($76.25 million) through the sale of bonds maturing in 10 years, three bankers said on Wednesday.
It will pay a coupon of 7.45%, payable quarterly, and has invited commitment bids for the issue on Thursday, they said.
The company did not immediately respond to a Reuters email seeking comment.
Here is the list of deals reported so far on January 28:
Issuer | Tenure | Coupon (in %) | Issue size (in bln rupees)* | Bidding date | Rating |
Summit Digitel Infrastructure | 10 years | 7.45(payable quarterly) | 7 | January 29 | AAA(Icra, Care) |
Cholamandalam Investment and Finance | two years and five months | 7.83 | 20 | January 27 | AA+ (Icra) |
360 One Prime | 2 years and four months | 8.80 | 7.51 | January 28 | AA (Icra) |
*Size includes base plus greenshoe for some issues
($1 = 91.8050 Indian rupees)
(Reporting by Dharamraj Dhutia and Khushi Malhotra; Editing by Janane Venkatraman)
((Dharamraj.dhutia@tr.com, khushi.malhotra@tr.com))