DesignCon 2026: 448G Serdes 依然还不是现实

光纤在线

03/04

3/04/2026，光纤在线讯，DesignCon 2026（美国圣克拉拉，2月24–26日）上编辑最关心的话题就是448G SerDes技术进展到底如何？去年的Designcon，448G没有如约，今年呢？虽然没能到现场，我通过AI整理了各厂商在448G SerDes技术上的布局与突破。本次大会中，芯片/IP、互连硬件、测试测量、EDA等领域头部厂商纷纷亮出448G SerDes相关成果，覆盖...

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SerDes相关成果，覆盖...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260304131917a6a096b0&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"SG9999004303.SGD","symbol_name":"Nikko AM Shenton Global Opportunities SGD","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260304131917a6a096b0&s=b","article_id":"2616583297","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260304131917a6a096b0&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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reality","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"2NVD.UK":0.6,"SNVD.UK":0.6,"NVD2.UK":0.6,"NVD":0.6,"NVDS":0.6,"COPJ":0.86,"NVDY":0.6,"NVDU":0.6,"CPER":0.86,"AIYY":0.6,"NVDB":0.6,"NVDX":0.6,"NVDD":0.6,"CPXR":0.86,"NVD3.UK":0.6,"MRVL":1.84,"NVIW.SI":0.6,"NVII":0.6,"NVDW":0.6,"NVDA":1.86,"NVDG":0.6,"XME":0.86,"ANV":0.6,"NVDQ":0.6,"DIPS":0.6,"3NVD.UK":0.6,"NVDS.UK":0.6,"COPX":0.86},"content_text":"3/04/2026，光纤在线讯，DesignCon 2026（美国圣克拉拉，2月24–26日）上编辑最关心的话题就是448G SerDes技术进展到底如何？去年的Designcon，448G没有如约，今年呢？虽然没能到现场，我通过AI整理了各厂商在448G SerDes技术上的布局与突破。本次大会中，芯片/IP、互连硬件、测试测量、EDA等领域头部厂商纷纷亮出448G SerDes相关成果，覆盖技术研发、产品落地、方案验证全环节，形成全产业链协同推进态势。（一）芯片/IP厂商：技术布局完善，逐步走向量产就绪- Marvell：展示448G SerDes IP，同步演示256 GT/s PCIe 8.0 SerDes（×16双向带宽达1TB/s，PCIe 8.0规范预计2028年定稿），适配AI交换机、GPU直连等448G核心应用场景，方案已进入工程样片阶段，为量产奠定基础。- NVIDIA：明确下一代Rubin平台将内置448G SerDes，配套NVLink 6交换机可实现单GPU双向带宽3.6TB/s，72颗GPU集群总带宽达260TB/s，依托448G技术支撑大规模AI集群算力调度，推动448G在高端AI场景的规模化应用。- 芯和半导体（国产）：推出XAI多智能体EDA平台，可实现448G链路仿真与全链路协同设计，助力国产芯片与互连方案的研发落地，填补国产EDA在448G领域的协同设计空白。（二）互连硬件厂商：铜互连为主流，成套方案密集发布共封装铜（CPC）成为448G SerDes短距（<1m）传输的主流架构，各互连厂商聚焦铜互连方案，推出线缆、连接器、端到端解决方案，验证448G铜互连的可行性与可靠性。- 立讯技术（Luxshare）：发布448G KOOLIO™ CPC to OSFP Airchannel™端到端方案，支持>90GHz带宽，兼容多模式448G传输，完成铜缆在448G场景的适用性验证，其负责人明确表示，在448G速率下铜连接仍将是主流，打破业界对铜连接无法支撑该速率的认知，同时公司448G产品已与多家客户展开预研工作。- 鸿腾精密（Foxconn）：联合安立（Anritsu）推出448G Twinax线缆，采用125GHz VNA完成高精度信号完整性表征，保障线缆传输可靠性，为448G高速传输提供稳定的线缆支撑。- Samtec：展示Si-Fly HD CPC连接器，可兼容224G/448G共封装铜互连，同步推出Bulls Eye BE130测试组件，支持448G差分信号测试，实现448G互连硬件与测试的协同配套。- Molex、TE Connectivity、Amphenol：均发布448G背板、板对板、OSFP全套互连方案，明确支持向1.6T速率平滑升级，适配AI数据中心高密度互连需求，其中安费诺等企业已与沃尔核材等供应商达成合作，推进448G相关产品落地。- 沃尔核材（国产）：已完成下一代单通道448G高速通信线样品的开发工作，已交给重点客户验证中，其224G产品已实现高端市场突破，为448G产品量产积累了技术与客户基础。（三）测试测量厂商：全链路方案成熟，护航量产落地448G SerDes高速传输对测试验证提出更高要求，头部测试厂商推出全链路测试方案，解决高速信号测试难题，成为448G量产的“最后防线”。- 是德科技（Keysight）、安立（Anritsu）、泰克（Tektronix）/Teledyne LeCroy：推出448G PAM4全链路测试方案，覆盖发射机SNDR、RLM、信道S参数、误码率等核心指标，支持自动化多端口矩阵测试；其中安立联合鸿腾精密完成448G Twinax线缆的信号完整性表征，进一步完善448G测试体系。- 核心设备升级：示波器与VNA（矢量网络分析仪）均覆盖125GHz+，可满足448G信号的完整表征，解决高速信号测试难度大的痛点，为448G技术的研发与量产提供可靠的测试支撑。（四）封装与材料厂商：适配高速需求，提供核心支撑448G SerDes对封装与材料的低损耗、低粗糙度要求大幅提升，相关厂商围绕核心需求推出适配方案：- 封装架构：共封装铜（CPC）成为芯片-封装-连接器的主流架构，可缩短信号路径、降低传输损耗，东莞市“轻有源”创新联合体也发布相关解决方案，推动448G高速铜互连技术演进。- 材料升级：VLP/ULP超低轮廓铜箔（亚微米级粗糙度）、低Dk/Df高速板材得到广泛应用，有效保障56GHz+高频信号的完整性，解决高速传输中的信号衰减问题，为448G高速传输提供材料支撑。（五）PAM6 技术成为重要趋势在AMD工程师主导的一场教程中，专家们提出了一个务实的观点：要想实现448Gbps，不能幻想PAM4的简单升级，而必须重新权衡设计。他们将PAM6定位为介于PAM4与PAM8之间的“中间路径”——相比PAM4，它提升了频谱效率；相比PAM8，它又没有过快地牺牲噪声容限。与会者普遍认识到，448G不仅仅是调制方式的挑战，更是**系统协同设计**的考验：模拟前端、均衡算法、编码以及前向纠错技术必须齐头并进。如何看待本次DesignCon上的448G 技术进展？AI给出的分析是：AI面临的三大核心挑战，需全产业链协同解决：- 信号完整性挑战：90GHz+带宽下，串扰、抖动、均衡复杂度急剧提升，对全链路协同设计、材料性能、封装工艺的要求大幅提高，成为448G量产的核心技术瓶颈。- 功耗控制挑战：448G SerDes单通道功耗较224G增加约50%，液冷散热与48V电源架构已成为448G系统的标配，如何平衡功耗与散热、成本，是厂商需要重点解决的问题。- 标准化与成本挑战：目前448G相关部分规范仍在完善中（如PCIe 8.0），同时高速材料、封装工艺的升级导致成本上升，如何推动技术标准化、降低量产成本，是实现448G规模化应用的关键。综上，448G技术依然是各大连接器，芯片，架构厂商发展的重点，只是这个技术的难度超过了包括编辑在内许多人的预期。技术的发展并不能简单的翻倍。448G SerDes受限，连带3.2T光模块技术发展一定受限，我们OFC再看。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}