UMC, HyperLight and Jabil collaborate to scale TFLN photonics for AI data center interconnects

Reuters
03/13
UMC, HyperLight and Jabil collaborate to scale TFLN photonics for AI data center interconnects

UMC, HyperLight, Wavetek, and Jabil announced a collaboration to support deployment of thin-film lithium niobate photonics for hyperscale AI data center interconnects. The companies said the work combines HyperLight’s photonic devices with UMC and Wavetek foundry manufacturing and Jabil’s high-volume manufacturing and assembly. UMC and Wavetek will support production using 6-inch and 8-inch wafer manufacturing capabilities. G C Hung of UMC said the collaboration extends to system-level integration with Jabil to support scaling and reliability requirements for AI data center infrastructure.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. UMC - United Microelectronics Corporation published the original content used to generate this news brief via Business Wire (Ref. ID: 202603130503BIZWIRE_USPR_____20260313_BW758941) on March 13, 2026, and is solely responsible for the information contained therein.

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