Lumentum reported an optical interconnect demonstration for AI scale-up networks using a high-density multimode 1060 nm VCSEL array co-packaged with a host ASIC. The system targets “slow and wide” scale-up protocols including UCIe and PCIe, and is implemented in a fan-out wafer-level package with multimode fiber connectivity. Lumentum said the VCSELs and photodetectors are integrated in a two-dimensional monolithic array with backside lens technology and support channel sparing. The company said the platform is designed for operating temperatures exceeding 150°C and is based on a 3D sensing manufacturing base that has shipped more than 10 billion emitters.

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