0530 GMT - Advanced chip packaging is critical for the industry to meet soaring demand for semiconductors that run AI applications, SEMI chief executive Ajit Manocha says. Traditional semiconductor scaling-following Moore's Law stating that the number of transistors in an integrated circuit doubles about every two years-has slowed, making it harder to improve performance by simply shrinking transistor sizes due to physical, economic, and technical limitations. By adding more interconnection between the chips-bundling multiple chiplets in a package-firms can bypass the limitations of Moore's Law and continue to advance function and performance, he adds. (sherry.qin@wsj.com)

(END) Dow Jones Newswires

May 07, 2026 01:31 ET (05:31 GMT)

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