0448 GMT - There is no significant change in TSMC's competitive landscape, according to Citi analysts. They note growing concern about long-term competition as TSMC customers consider alternatives in foundry and advanced packaging. But the analysts reckon the Taiwanese chip maker's predictable yields, cycle times and cost control at high volumes provide a significant advantage, giving it an edge over competitors. Meanwhile, they don't expect Intel's advanced-packaging technology called EMIB-T to alter TSMC's competitive landscape. Citi says in a note it expects TSMC's CoWoS packaging technology capacity to continue growing at nearly 85% and 60%, respectively, in 2026 and 2027, on strong hyperscaler AI demand. (sherry.qin@wsj.com)

(END) Dow Jones Newswires

May 14, 2026 00:48 ET (04:48 GMT)

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