Providers of Advanced Packaging Equipment to Benefit From Huawei's New Chip-Design Approach -- Market Talk

Dow Jones

05/27

0453 GMT - Providers of advanced packaging equipment and services are likely to be key beneficiaries of Huawei's new chip-design approach, Citi analysts say in a research note. The new design approach is a credible response to U.S. restrictions on exports of advanced chips and a shift toward innovations in chip and system designs, they note. Given Huawei's lack of access to advanced equipment, the Chinese company aims to narrow the chip performance gap through 3D integration, hybrid bonding, logic/memory fusion and other innovations, Citi says. Makers of advanced packaging equipment, especially providers of hybrid bonders, could be key beneficiaries, as could outsourced chip assembly and test providers given rising packaging complexity. Within Citi's coverage, the bank prefers ASMPT for its broadening advanced-packaging-solution offerings. (sherry.qin@wsj.com)

(END) Dow Jones Newswires

May 27, 2026 00:53 ET (04:53 GMT)

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The new design approach is a credible response to U.S. restrictions on exports of advanced chips and a shift toward innovations in chip and system designs, they note. Given Huawei's lack of access to advanced equipment, the Chinese company aims to narrow the chip performance gap through 3D integration, hybrid bonding, logic/memory fusion and other innovations, Citi says. Makers of advanced packaging equipment, especially providers of hybrid bonders, could be key beneficiaries, as could outsourced chip assembly and test providers given rising packaging complexity. Within Citi's coverage, the bank prefers <a href=\"https://laohu8.com/S/00522\">ASMPT</a> for its broadening advanced-packaging-solution offerings. (sherry.qin@wsj.com) \n</p>\n<pre style=\"white-space: pre\">\n \n</pre>\n<p>\n  (END) Dow Jones Newswires\n</p>\n<p>\n  May 27, 2026 00:53 ET (04:53 GMT)\n</p>\n<p>\n  Copyright (c) 2026 Dow Jones &amp; Company, Inc.\n</p>\n</font>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Providers of Advanced Packaging Equipment to Benefit From Huawei's New Chip-Design Approach -- Market Talk</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nProviders of Advanced Packaging Equipment to Benefit From Huawei's New Chip-Design Approach -- Market Talk\n</h2>\n\n<h4 class=\"meta\">\n\n\n<div class=\"head\" \">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/150f88aa4d182df19190059f4a365e99);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Dow Jones </p>\n<p class=\"h-time\">2026-05-27 12:53</p>\n</div>\n\n</div>\n\n\n</h4>\n\n</header>\n<article>\n<font class=\"NormalMinus1\" face=\"Arial\">\n<p>\n     0453 GMT - Providers of advanced packaging equipment and services are likely to be key beneficiaries of Huawei's new chip-design approach, Citi analysts say in a research note. The new design approach is a credible response to U.S. restrictions on exports of advanced chips and a shift toward innovations in chip and system designs, they note. Given Huawei's lack of access to advanced equipment, the Chinese company aims to narrow the chip performance gap through 3D integration, hybrid bonding, logic/memory fusion and other innovations, Citi says. Makers of advanced packaging equipment, especially providers of hybrid bonders, could be key beneficiaries, as could outsourced chip assembly and test providers given rising packaging complexity. Within Citi's coverage, the bank prefers <a href=\"https://laohu8.com/S/00522\">ASMPT</a> for its broadening advanced-packaging-solution offerings. (sherry.qin@wsj.com) \n</p>\n<pre style=\"white-space: pre\">\n \n</pre>\n<p>\n  (END) Dow Jones Newswires\n</p>\n<p>\n  May 27, 2026 00:53 ET (04:53 GMT)\n</p>\n<p>\n  Copyright (c) 2026 Dow Jones &amp; Company, Inc.\n</p>\n</font>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0227179875.USD","symbol_name":"SCHRODER ISF ASIAN SMALLER COMPANIES \"A\" ACC","start_time":0,"source_url":"https://dowjonesnews.com/newdjn/logon.aspx?AL=N","article_id":"2638575479","we_media_id":"106","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2638575479","pubTimestamp":1779857580,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Dow Jones","introduction":"Dow Jones publishes the world’s most trusted business news and financial information in a variety of media.","home_visible":0,"id":"106","head_image":"https://static.tigerbbs.com/150f88aa4d182df19190059f4a365e99"},"summary":"0453 GMT - Providers of advanced packaging equipment and services are likely to be key beneficiaries of Huawei's new chip-design approach, Citi analysts say in a research note. The new design approach is a credible response to U.S. restrictions on exports of advanced chips and a shift toward innovations in chip and system designs, they note. Given Huawei's lack of access to advanced equipment, the Chinese company aims to narrow the chip performance gap through 3D integration, hybrid bonding, logic/memory fusion and other innovations, Citi says. Makers of advanced packaging equipment, especially providers of hybrid bonders, could be key beneficiaries, as could outsourced chip assembly and test providers given rising packaging complexity. Within Citi's coverage, the bank prefers ASMPT for its broadening advanced-packaging-solution offerings. 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The new design approach is a credible response to U.S. restrictions on exports of advanced chips and a shift toward innovations in chip and system designs, they note. Given Huawei's lack of access to advanced equipment, the Chinese company aims to narrow the chip performance gap through 3D integration, hybrid bonding, logic/memory fusion and other innovations, Citi says. Makers of advanced packaging equipment, especially providers of hybrid bonders, could be key beneficiaries, as could outsourced chip assembly and test providers given rising packaging complexity. Within Citi's coverage, the bank prefers ASMPT for its broadening advanced-packaging-solution offerings. (sherry.qin@wsj.com) \n\n\n \n\n\n  (END) Dow Jones Newswires\n\n\n  May 27, 2026 00:53 ET (04:53 GMT)\n\n\n  Copyright (c) 2026 Dow Jones & Company, Inc.","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":true,"editions":null,"column":"","sentiment":"0","news_tag":"corporation","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":true,"need_login_tip":false,"code":"91000000","status":"200"}}}