TCL Technology Group (SHE:000100) will raise 2 billion yuan via two tranches of corporate bonds, according to a Thursday after-hours filing with the Shenzhen bourse.

The two tranches have a size of 1 billion yuan each, the appliance maker said.

The first tranche has a term of three years with a rate of 1.85% and an oversubscription rate of 2.9 times, while the second tranche has a coupon rate of 2.1% and was oversubscribed 1.2 times.

The bonds form part of a 10 billion yuan bond program.