0234 GMT - AI-driven changes in memory architecture could create new growth opportunities for Taiwanese memory suppliers AP Memory and Macronix, Morgan Stanley says. The bank expects 3-D stacking to emerge as the next major memory architecture beyond today's 2.5-D HBM designs, increasing the importance of technologies such as hybrid bonding and wafer-on-wafer integration. Meanwhile, NAND flash is taking on a larger role in AI systems, supporting tasks such as model storage and inference processing rather than serving only as storage. That trend is expected to boost demand for higher-performance NAND products, according to Morgan Stanley.