Shipments of High Bandwidth Memory Chips to Become More Visible in 2H

Dow Jones
昨天

0043 GMT - Shipments of a new generation of high-bandwidth memory chips for AI applications, known as HBM4, are expected to become more visible in 2H, according to a Counterpoint Research report. In the HBM market, SK Hynix remained the leader with a 50% revenue share in 2Q, while Samsung increased its share to 33% from 15% a year earlier, the report says. In the broader DRAM market, Samsung retained the top spot with a 38% share, while Chinese memory maker CXMT continued to gain ground, more than doubling its market share to 10% from 4% a year earlier, according to Counterpoint.

 

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