Taiwan on Monday began work on the new advanced packaging industrial park with the groundbreaking ceremony of Baipu Industrial Park, in Kaohsiung, Taiwan, where chipmaker Taiwan Semiconductor Manufacturing Co (TPE:2330) also plans to establish facilities, according to a same-day official statement.

TSMC plans to develop a three-hectare site featuring two buildings with modular facilities including a technology validation laboratory and a talent training centre.

The facilities are expected to begin operations in the fourth quarter ⁠of 2029, local media reports, quoting Kaohsiung Deputy Mayor Lo Ta-sheng as saying at the groundbreaking ceremony.