Sumitomo Bakelite (TYO:4203) will increase production capacity for encapsulation materials used in advanced semiconductor packages at its China and Singapore plants, according to a Friday statement.

The company plans to start production at its Suzhou site in fiscal 2030 and at Singapore at the end of fiscal 2028.

The company expects production capacity for mold underfill materials to double and compression-molding granules to triple after increasing the production capacity.

A planned acquisition of Japan-based Kyocera's (TYO:6971) chemical business by October should also add to the production capacity of the materials, the company said.