On September 11, Luster Lighttech Co.,Ltd. stated on an interactive platform that the company's agency-introduced optoelectronic integrated chip design and packaging solutions primarily utilize 3D lithography processes to fabricate polymer waveguides of arbitrary shapes. By replacing traditional lens coupling with photonic wire bonding, the solutions offer high alignment precision, reduced optical signal attenuation, and suitability for industrial mass production applications, making them applicable for CPO/OIO small-size multi-channel packaging.