On June 16, Amkor Technology rose 6.32% in regular trading, trading at $92.075/share, with turnover of $91.01 million.

On the news front, TSMC and Amkor Technology announced a long-term partnership aimed at accelerating advanced packaging technology development and capacity deployment in the US market. The collaboration marks a deeper resource integration between the two semiconductor giants to jointly build a domestic advanced packaging ecosystem in the United States.

Additionally, Amkor is considering a 1 trillion KRW (approximately $742 million) expansion of its Gwangju, South Korea facility, driven by a significant surge in TSMC packaging and testing orders that have outpaced existing production line capacity. The first phase targets 500 billion KRW in investment to be completed before 2030. The company previously set 2030 financial targets at its Investor Day: revenue exceeding $11 billion and EPS above $5, approximately three times current levels, with growth anchored in 2.5D/HDFO/CPO advanced packaging platforms tied to AI computing demand and chip manufacturing reshoring.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)