On May 27, ASE Technology rose 3.47% in pre-market trading, trading at $40.36/share, with trading volume of $261,800.

On the news front, AMD previously announced an investment exceeding $10 billion in Taiwan's semiconductor and AI industry ecosystem. ASE Technology, as a core outsourced semiconductor assembly and test (OSAT) partner, will co-develop next-generation 2.5D bridge interconnect technology with AMD, directly benefiting from capacity expansion and order expectations tied to this large-scale investment.

Additionally, ASE's subsidiary launched an automated 310mm panel-level packaging production line, enabling seamless transition from wafer-level to panel-level packaging. The new line is expected to begin production in H1 2027, with the larger panel format supporting higher throughput and reduced cycle time, further expanding advanced packaging growth potential.

Within the Semiconductors sector, Micron Technology rose 4.2%, NVIDIA fell 0.45%, AMD rose 0.07%, Intel fell 1.11%, and Broadcom rose 0.04%.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)