As AI chips continue to evolve towards larger sizes and greater complexity, competition in next-generation packaging and substrate technologies is intensifying, with glass substrates emerging as a central industry focus.

According to South Korean media reports, glass substrates are forecasted to begin early commercialization in 2027, enter a capacity ramp-up phase by 2029, and achieve full-scale mass production starting in 2030. The report indicates that NVIDIA and Alphabet are the most likely end customers to adopt this technology first, both being key players in the AI accelerator chip market.

This timeline aligns closely with recent statements from TSMC's chairman, C.C. Wei. At a shareholder meeting on June 4, Wei stated that TSMC has established a CoPoS pilot production line, with meaningful capacity increases expected within two to three years. TSMC's entry further confirms that the commercialization path for glass substrates, moving from the lab to mass production, is accelerating.

From a market perspective, the rising costs of TSMC's silicon-based CoWoS packaging are seen as a significant catalyst for accelerating the adoption of glass substrates. As companies including Intel, Samsung Electro-Mechanics, SKC's subsidiary Absolics, and LG Innotek accelerate their strategic moves, the competitive landscape in this field is taking shape.

Rising CoWoS Costs Strengthen the Rationale for Glass Substrates

Analysis suggests that the sustained, high-intensity investment by hyperscale cloud computing companies in next-generation infrastructure and advanced packaging is the core driver of demand for glass substrates. Compared to traditional organic substrates, glass substrates offer superior heat resistance and anti-warping properties, providing scalability advantages for interconnecting larger, higher-density GPUs and HBM.

Cost factors are also significant. The average selling price for a TSMC CoWoS wafer is approximately $10,000, comparable to advanced 7-nanometer process nodes, highlighting how advanced packaging has evolved into a high-value-added competitive arena. It is noted that the ongoing increase in CoWoS unit costs is prompting customers to evaluate alternative packaging solutions centered on glass substrates.

Another report indicates that TSMC introduced a 310×310 mm CoPoS platform in 2025, using glass as an interposer material, further validating the technical feasibility of glass substrates in high-end packaging.

TSMC and Intel Outline Their Roadmaps

Among major platform providers, TSMC's CoPoS pilot line has entered a substantive implementation phase. Chairman Wei stated that meaningful capacity ramp-up is anticipated within two to three years, a timeframe that aligns with industry predictions for early commercialization around 2027.

According to reports, Intel's wafer fabrication plant in Rio Rancho, New Mexico, is currently producing silicon photonics products for external customers and has demonstrated the first prototypes of glass substrates integrated with co-packaged optics, with a commercialization target also set around 2030. Intel's entry signifies that competition in the glass substrate arena is expanding from packaging firms to wafer fabrication.

Korean Manufacturers Accelerate Deployment, with SKC Most Aggressive

Within the Korean contingent, SKC, Samsung Electro-Mechanics, and LG Innotek are simultaneously accelerating their preparations for mass production. Reports state that all three companies have begun production qualification testing with end customers, with SKC considered the most aggressive player.

SKC has completed a 1.2 trillion won rights offering and plans to inject an additional 589.6 billion won into its glass substrate subsidiary, Absolics. Absolics recently initiated a project to supply "non-embedded" glass substrate prototypes to a U.S. telecommunications chip company. Its glass substrates target the high-performance server and AI accelerator markets, offering a 25% reduction in thickness and over 30% improvement in power efficiency compared to traditional organic interposers.

Samsung Electro-Mechanics has a clearer path to mass production. It operates a glass substrate pilot line at its Sejong plant in South Chungcheong Province, aiming for mass production in the second half of 2027, and is already conducting quality evaluations with Broadcom and several hyperscale cloud computing firms.

LG Innotek is also viewed as a new entrant in this field. It has established a pilot line at its Gumi plant and earlier this year entered a research collaboration with UTI to focus on enhancing the mechanical strength of glass substrates. UTI, known for its ultra-thin glass used in foldable smartphones for brands like Samsung, is now extending its glass processing technology to the substrate field. This cross-industry move could provide support for material technology upgrades in glass substrates.