On August 4, Intel rose 3.38% in pre-market trading, trading at $94.226/share, with turnover of $22.45 million.

On the news front, Intel's EMIB-T advanced packaging technology yield has surpassed 90%, with mass production expected next year. Simultaneously, MediaTek publicly confirmed for the first time that its ASIC project has adopted Intel's EMIB-T packaging technology, marking a significant validation of Intel's foundry capabilities.

According to prior disclosures, EMIB-T costs approximately 50% less than TSMC's CoWoS solution, positioning Intel competitively in the AI chip packaging race. Intel plans to offer large-scale EMIB-T packaging services starting next year, though substrate yield remains at roughly 50%, representing a key bottleneck for capacity expansion. MediaTek's dual-track approach — leveraging both TSMC CoWoS and Intel EMIB-T — underscores that packaging has become a core competitive dimension in AI chip solutions, no longer subordinate to process node advancement alone. The stock had declined 4.2% in the prior session amid broad semiconductor sector weakness, making today's rebound notable.

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