Shares of ASMPT (HKEX: 00522) surged more than 7% during the trading session, reaching a new all-time high of HK$233.60. At the time of writing, the stock was up 6.36% at HK$230.80, with a trading turnover of HK$509 million.

Analysts have noted the company's strong first-quarter order performance, with demand for artificial intelligence technologies extending from advanced packaging into mainstream back-end processes. Developments in silicon photonics and chip-on-substrate-on-substrate (CoPoS) technologies are seen as opening up long-term growth opportunities.

Further commentary highlighted progress with thermal compression bonding (TCB) and hybrid bonding (HB) equipment. The anticipated commencement of shipments for HBM4 and 16-layer/20-layer high-bandwidth memory products is expected to further strengthen the demand outlook for TCB. ASMPT is actively expanding its customer base in both memory and logic advanced packaging, with this business segment viewed positively for its long-term potential to enhance both financial performance and company valuation.