On July 9, ASMPT rose 3.19% in regular trading, trading at 188.8 HKD/share, with turnover of HKD 108 million. The stock staged a technical rebound after pulling back over 18% from its all-time high of 232 HKD set on June 30.

On the news front, the semiconductor equipment sector showed broad-based strength, with GCL Technology up 3.23%, CFMEE up 1.67%, and SICC up 1.36%. Citi previously raised its target price for ASMPT to 250 HKD while maintaining a buy rating, noting the company's leading position in TCB (thermocompression bonding) and advanced packaging solutions makes it a primary beneficiary of accelerating industry capital expenditure. Additionally, Samsung Electronics and SK Hynix plan to significantly advance their wafer fab completion timelines, with SK Hynix moving its Yongin semiconductor cluster completion forward by 12 years, potentially driving rapid expansion in equipment vendor orders.

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