EV Group (EVG), a supplier of innovative process solutions and technologies, has announced active collaborations with customers and partners within the rapidly evolving co-packaged optics (CPO) ecosystem. These efforts aim to address the demands of hyperscale data centers, AI infrastructure, and high-performance computing applications.
Leveraging its extensive portfolio of wafer bonding, nanoimprint lithography, and thin-wafer processing technologies, EVG is tackling the challenges presented by CPO. This is further supported by the company's NILPhotonics® competence center and its Heterogeneous Integration Competence Center™, which allow customers and partners to develop, optimize, and validate new product designs and manufacturing processes in a near-production environment before transitioning to high-volume manufacturing. This approach accelerates time-to-market and mitigates implementation risks.
EVG's process portfolio addresses several critical manufacturing needs within the CPO ecosystem. Hybrid bonding enables low-parasitic integration of photonic integrated circuits (PICs) with electronic integrated circuits to support future bandwidth requirements. Fusion bonding supports the heterogeneous integration of III-V semiconductor materials for laser manufacturing, as well as emerging modulator materials. Oxide-free room-temperature bonding ensures low-loss, optically transparent interfaces and integrates heat-dissipating materials such as diamond and silicon carbide for effective thermal conduction across interfaces.
With its established expertise in 3D and heterogeneous integration within the semiconductor industry, EVG is well-positioned to support current CPO implementations and future optical I/O architectures. The company is extending mature electronic integration concepts to next-generation optoelectronic systems. EVG provides advanced process solutions and specialized know-how for cutting-edge semiconductor design and chip integration, focusing on the forward-looking development of new technologies to support next-generation micro- and nano-manufacturing applications.
EVG's series of products ready for high-volume manufacturing includes wafer bonding, lithography, thin-wafer handling, and metrology equipment. These products continue to drive advancements in front-end semiconductor scaling, 3D integration, advanced packaging, and other electronic and photonics applications.