On June 24, Guanghe Technology (01989.HK) fell 3.17% in regular trading, trading at 163.5 HKD/share, with turnover of 71.63 million HKD.

On the news front, the stock has been under sustained selling pressure after hitting a near one-year high of 206.66 HKD on June 17. The company recently unveiled a massive expansion plan including a 3.6 billion yuan convertible bond issuance targeting cloud computing PCB capacity expansion and high-multilayer production line upgrades, alongside a 6 billion yuan Dongguan Smart Manufacturing Headquarters project. The combined financing scale of nearly 10 billion yuan has weighed on market sentiment.

Additionally, a Citibank research report highlighted that major copper-clad laminate suppliers capacity growth of just over 20% significantly lags downstream PCB expansion, concentrating pricing power upstream and intensifying cost pass-through pressure for PCB manufacturers. The company reported Q1 revenue growth of 71.35% and net profit growth of 63%, but near-term share price remains pressured by technical pullback from elevated levels and upstream cost squeeze.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)