CFMEE shares surged more than 8% in the afternoon session, with the stock climbing 7.83% to HK$407.60 at the time of writing, on a trading turnover of HK$346 million.

The rapid advancement of AI hardware is raising performance requirements for PCBs, and the application boundaries of mSAP technology continue to widen, setting the stage for production expansion. According to public data, CFMEE, a leading player in PCB direct-write lithography, boasts a resolution capability of 6/6μm with its MAS6P series LDI equipment, achieving production efficiency that outpaces comparable international products.

Guosheng Securities noted that the accelerated expansion of AI PCB manufacturing is driving upstream demand for LDI equipment. Combined with the imminent ramp-up in advanced packaging business, the brokerage has raised its earnings forecast for the company, projecting net profits attributable to shareholders of RMB 516 million, RMB 874 million, and RMB 1.147 billion for 2026, 2027, and 2028 respectively, representing year-on-year growth of 78%, 69%, and 31%.