On September 19, Amkor Technology rose 5.07% in regular trading, trading at $50.37/share, with turnover of $126 million, extending the prior session's rebound momentum.

On the news front, the company recently announced the launch of Phase 2 construction of its advanced packaging and test campus in Arizona, raising the total planned investment to approximately $12 billion. The large-scale capital expenditure initially triggered concerns over near-term earnings dilution, sending shares down to the $46 level. However, multiple institutions have since reaffirmed the long-term growth thesis. Morgan Stanley highlighted that AI semiconductor capital spending will continue to grow, with 2.5D advanced packaging capacity expected to increase by another 50%, and non-TSMC advanced packaging capacity projected to expand to 55-60 kwpm by the end of 2028. UBS also noted that Amkor's advanced packaging business is expected to grow from 9% to 19% of sales by 2027 at above-average gross margins, driven by its expanding role in packaging products for major chipmakers.

The broader semiconductor equipment sector rallied sharply on the day, with Lam Research up 6.99%, Applied Materials up 6.58%, Teradyne up 5.16%, and KLA Corporation up 4.70%, providing additional upward momentum through sector-wide strength.

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