On September 9, the 2025 German International Motor Show and Smart Mobility Exhibition (IAA Mobility 2025) officially opened in Munich. Intelligent automotive computing chip leader BLACK SESAME (02533) once again took the stage at this international platform that "previews" the future of mobility (Booth: Hall B2 A14), comprehensively showcasing its "chip" capabilities from cockpit-driving integration to advanced driver assistance, exploring the AI-driven future of intelligent vehicles together with global automotive industry leaders and partners.

**Safe Intelligent Foundation Solution Makes International Debut, Addressing Cross-Domain Integration Challenges**

Automotive companies often face security and cost challenges in cross-domain integration. Taking advantage of this IAA Mobility, BLACK SESAME demonstrated its "Safe Intelligent Foundation" solution to the international market for the first time. This solution centers on BLACK SESAME's Wudang C1200 family cross-domain integration chips, providing automotive companies with a seamless upgrade path for intelligent cockpit and driver assistance functions from entry-level to flagship models through hardware-level security isolation, platform-based computing expansion, and full lifecycle compatibility design.

This "Safe Intelligent Foundation" solution represents a milestone step toward "cockpit-driving integration" in electronic and electrical architecture, helping automotive companies achieve "develop once, reuse across multiple generations," thereby significantly reducing development costs, shortening development cycles, and increasing market competitiveness.

**Huashan A2000 Chip Samples Unveiled, Creating Benchmark for Full-Scenario General Assistant Driving**

Another major highlight at BLACK SESAME's booth was the Huashan A2000 chip samples. As a chip platform designed for next-generation AI models with higher performance and efficiency, the Huashan A2000 family chips integrate industry-leading CPU, DSP, GPU, NPU, MCU, ISP, and CV functional units, achieving high integration and single-chip multi-task processing capabilities. It features the industry's largest NPU core - BLACK SESAME's Jiushao™, and the new-generation general AI toolchain BaRT provides guarantees for the full utilization and flexible expansion of "Jiushao" computing performance, forming a powerful driver assistance technology foundation that ensures the performance leap of the Huashan A2000 family.

Additionally, the Huashan A2000 chip can meet the needs of multiple fields including robotics and general computing. Currently, BLACK SESAME is collaborating with the team of Academician Liu Sheng from the Chinese Academy of Sciences and Executive Dean of Wuhan University Industrial Science Research Institute, as well as intelligent robot development company Fourier, in areas such as humanoid robots and dexterous hands.

**Wudang C1200 Family Debuts with Partners, Demonstrating Commercialization Strength**

BLACK SESAME's Wudang series chips focus on cross-domain computing. Within the Wudang C1200 family, the C1236 is the first domestic single SoC chip supporting navigation assistance driving functions, while the C1296 is the industry's first chip supporting multi-domain fusion computing. Since the launch of Wudang C1236 and C1296 chips, BLACK SESAME has successively collaborated with automotive companies and Tier 1 suppliers to develop related solutions.

At this exhibition, BLACK SESAME not only presented these two chips but also showcased Aptiv's cockpit-driving integration solution developed based on the C1296 chip. Currently, multiple leading domestic and international companies including Aptiv, Continental, Joyson, and Banma have developed cross-domain fusion solutions based on the C1296 chip.

The maturity of C1296 cross-domain fusion solutions has gained market recognition. The Wudang series chips will become the industry's first cockpit-driving integration mass production chip platform. Multiple new models under Dongfeng Motor will adopt cockpit-driving integration solutions built on C1296 chips, with plans to reach mass production status by the end of 2025.

**Huashan A1000 Family Mass Production Results Display, Mature Ecosystem Accelerates Volume Production**

Commercial results attracting attention include not only the Wudang C1200 family, but also the Huashan A1000 family on BLACK SESAME's booth. This time, BLACK SESAME comprehensively showcased the mature and complete mass production software ecosystem and applications of the Huashan A1000 family.

Currently, A1000 family chips have been mass-produced and deployed in multiple vehicle models including Geely Galaxy E8 and Xingyao 8, Lynk & Co 07 and Lynk & Co 08 EM-P, and Dongfeng Yipai eπ007 and Yipai eπ008.

From the innovative design of the "Safe Intelligent Foundation" to the performance breakthrough of the Huashan A2000 family, and the accelerated commercialization of the Wudang C1200 family and Huashan A1000 family, BLACK SESAME provides the automotive industry with more cost-effective, safer, and more reliable driver assistance technology paths through its dual-wheel drive model of "chips + solutions."

BLACK SESAME will continue to uphold the philosophy of innovation and open cooperation, deepening collaboration with global industrial chain partners, and driving innovation in driver assistance technology with "chip" power.