HUAQIN (Huaqin Co., Ltd.) has completed the issuance of its 2026 second tranche of publicly offered sci-tech innovation corporate bonds to professional investors.

The tranche, marketed under the abbreviation “26 Huaqin K2” and code 245153.SH, secured RMB1.20 billion at a coupon rate of 1.80% and an issue price of RMB100 per unit. With a three-year tenor, the bonds attracted a subscription multiple of 3.41 times, underscoring solid demand from the professional market.

This issuance forms part of the company’s RMB2.00 billion sci-tech innovation bond programme approved by the China Securities Regulatory Commission (CSRC) in October 2025 (Permit [2025] No. 2327). The board and shareholders had authorized the programme at meetings held on 23 April 2025 and 14 May 2025, respectively. HUAQIN previously completed a first-tranche issue on 19 January 2026.

No directors, senior management, or shareholders holding more than 5 % of the company’s issued shares participated in the subscription. Lead underwriter CITIC Securities and its affiliates subscribed for RMB0.17 billion of the bonds. The transaction does not constitute a notifiable or connected transaction under Chapters 14 and 14A of the Hong Kong Listing Rules.

The proceeds add to HUAQIN’s funding pool without altering existing shareholder interests, while the successful oversubscription highlights continued investor confidence in the company’s credit profile.