On June 9, Tian Yue Advanced rose 5.45% in regular trading, trading at HKD 94.05/share, with trading volume of HKD 229 million.

On the news front, the silicon carbide (SiC) industry chain is experiencing elevated prosperity, with high-quality substrate wafers in tight supply and prices rising notably. Major substrate manufacturers are operating at capacity utilization rates exceeding 90%, while chip and module companies face supply shortfalls with delivery lead times extending significantly. Industry sources indicate that AI data center order growth, semiconductor sector-wide pricing momentum, and robust demand from EV, solar, and charging infrastructure markets are collectively driving the upcycle.

As the global leader in 8-inch SiC substrates with 51.3% market share, Tian Yue Advanced is positioned to directly benefit from the volume and price uplift across the supply chain. The company's 12-inch SiC substrate has entered TSMC's supply chain verification stage as a potential next-generation CoWoS interposer candidate, further strengthening its growth outlook amid surging AI-related power semiconductor demand.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)