Initial public offering subscriptions for CFMEE (HKEX: 09630) are currently oversubscribed by 194 times, based on the margin financing provided by brokers.

The company's offering period runs until June 23, with plans to issue approximately 12.84 million H shares. The retail portion in Hong Kong accounts for 10% of the total offering, with a price range set between HK$240.09 and HK$252.73 per share. This could raise up to HK$3.24 billion.

As of June 22, broker margin financing for the IPO had reached HK$63.3 billion. Each board lot consists of 50 shares, requiring a minimum investment of HK$12,763.9. Trading is expected to commence on June 26, with China International Capital Corporation (CICC) acting as the sole sponsor.

The company is recognized as the world's largest supplier of PCB direct imaging equipment. It provides these systems along with semiconductor direct-write lithography equipment for the AI era. Its business focuses on the development of high-precision micro-nano lithography technology and its application across various innovative uses, including the manufacturing, sales, and maintenance of direct imaging and direct-write lithography systems for a global clientele.

According to industry research, the company ranks as the fourth-largest global supplier of direct-write lithography equipment by projected 2025 revenue, holding a market share of 9.4%. The global PCB direct imaging equipment market is relatively concentrated, with the top five suppliers expected to hold a combined market share of approximately 59.1% in 2025.

By projected 2025 operating revenue, the company is the leading global supplier of PCB direct imaging equipment, commanding an 18.8% market share. Its closest competitor holds a 15.7% share, with other major players holding similar portions of the market.

As of the end of 2025, the company is reportedly the only global firm with commercialized products covering all applications for PCB, IC substrates, advanced packaging, and photomasks. It is also one of only two domestic companies in its market with products covering advanced packaging applications and one of only three with products covering photomask applications.