On July 2, ASE Technology rose 4.68% in pre-market trading, trading at $43.85/share, with turnover of $2.436 million.

On the news front, the company announced on July 1 another round of advanced packaging price increases, with the highest hike exceeding 20%. The pricing power catalyst had previously been overshadowed by a broad semiconductor sector selloff on July 1, during which peers including Micron Technology fell 6.11%, Intel dropped 5.43%, and NVIDIA declined 1.94%. As sector selling pressure eased, the price-hike narrative regained market recognition.

Additionally, Bank of America previously raised its valuation expectations for ASE Technology, projecting the server CPU-related packaging and testing market to expand from $1.9 billion to $9.6 billion, underscoring advanced packaging as the most defensible segment in the semiconductor supply chain. The price increase follows a broader industry trend, with nearly 20 analog and power semiconductor companies launching a new round of price hikes effective July 1.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)