On November 14, the China Securities Regulatory Commission (CSRC) released its "Supplementary Material Requirements for Overseas Listing Filings (November 10–14, 2025)." Among the disclosures, the CSRC requested Amlogic Semiconductor (Shanghai) Co., Ltd. (referred to as Amlogic Semiconductor) to provide additional details regarding the ownership structure of its indirect controlling shareholder, Amlogic Group, among other matters.
According to a September 25 filing with the Hong Kong Stock Exchange, Amlogic Semiconductor submitted its listing application for the main board, with China International Capital Corporation (CICC) and Haitong International as joint sponsors.
The CSRC has asked Amlogic Semiconductor to supplement the following information and instructed legal counsel to verify and provide a clear legal opinion:
1. **Registration Updates**: - Progress on the industrial and commercial registration procedures for changes in the company’s registered capital. - Progress on transferring 100% equity of Xinmai Micro to the company’s name, along with a description of Xinmai Micro’s basic details, similar to other subsidiaries.
2. **Business Scope Clarification**: - Details on subsidiaries engaged in advertising design, production, agency, and distribution, as well as property management—including whether these businesses are operational, their specific operations, and necessary licensing.
3. **Ownership Structure Disclosure**: - Compliance with the "Regulatory Guidelines for Overseas Listings No. 2" to disclose the ownership structure of indirect controlling shareholder Amlogic Group and confirm whether any shareholders are prohibited by law.
4. **Over-Allotment Details**: - The total number and proportion of H-shares to be issued if the over-allotment option is fully exercised.
According to its prospectus, Amlogic Semiconductor is a globally leading fabless semiconductor company specializing in system-on-chip (SoC) solutions. It provides cutting-edge control and connectivity solutions for smart home, office, mobility, entertainment, education, and industrial applications, including multimedia/display SoCs, AIoT SoCs, connectivity chips, and automotive SoCs, driving the transition from IoT to AIoT in smart devices worldwide.