On May 26, ASE Technology rose 9.16% in pre-market trading, trading at $37.98/share, with trading volume of approximately $241,400.

On the news front, AMD announced an investment exceeding $10 billion in Taiwan's semiconductor and AI ecosystem to expand strategic partnerships and enhance advanced packaging manufacturing capacity for next-generation AI infrastructure. ASE Technology, as a core packaging and testing partner, stands to directly benefit from the massive investment through expanded capacity and order expectations. AMD is collaborating with ASE and SPIL to develop next-generation wafer-based 2.5D bridge interconnect technology, which significantly improves interconnection bandwidth and power efficiency to support AMD's Venice CPU and Helios rack-level AI platform deployment in the second half of this year.

Additionally, the stock had previously declined over 15% due to large-scale insider selling by Director Jeffrey Chen combined with systemic semiconductor sector weakness, creating a notably oversold condition. The company's fundamentals remain robust, with strong Q1 results, packaging and testing service price increases of 5% to 20%, and an advanced packaging revenue target raised to $3.5 billion. Sector peers including Micron Technology up 3.86% and Intel up 1.74% reflect continued sentiment recovery.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)