On July 15, ASMPT rose 4.89% in regular trading, trading at HK$195.0/share, with turnover of HK$64.53 million.

On the news front, Goldman Sachs issued a research report raising its target price for ASMPT to HK$206, citing expectations that the company will benefit from advanced packaging trends driven by the AI infrastructure upcycle. The bank raised its AI server chip shipment forecasts for 2026-2028 by 14%, 22%, and 14% respectively, projecting that rising AI infrastructure end-demand will boost ASMPT thermocompression bonding equipment and PCB SMT tool shipments. Goldman Sachs expects a 36% net profit CAGR for 2026-2028 and lifted 2027 and 2028 EPS estimates by 16% and 22% to HK$5.75 and HK$6.89. Earlier, Citi had also raised its target price significantly to HK$250, maintaining a Buy rating, highlighting ASMPT's leading position in TCB and advanced packaging solutions.

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