On July 8, CFMEE (09630.HK) rose 3.12% in regular trading, trading at 392.4 HKD/share, with turnover of approximately 9.76 million HKD. The rebound comes as the company's self-developed PLP 2000 panel-level packaging direct-write lithography equipment recently secured an important customer order in the advanced packaging sector.

The PLP 2000 is China's first 510mm×515mm panel-level packaging direct-write lithography system, supporting a maximum processing size of 600mm×600mm. The equipment meets 2μm mass production resolution requirements for CoPoS, FOPLP, and glass substrate packaging processes, marking a significant breakthrough in domestic advanced packaging lithography capabilities. The company previously disclosed that its production lines are running at full capacity with robust order visibility, driven by AI server, high-end substrate, and advanced packaging expansion demand.

The stock had previously corrected from post-IPO highs after debuting on June 26 at 252.73 HKD and surging to approximately 515 HKD on its first trading day. Subsequent profit-taking and broader semiconductor equipment sector weakness pushed the stock to recent lows near 381 HKD, creating conditions for a technical rebound on fundamental catalysts.

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