At the BYD Intelligentization Strategy Launch Event held today, Wang Chuanfu, Chairman and President of BYD Group, delivered a keynote speech.

During the presentation, Wang unveiled China's first 4nm intelligent driving chip, named "Xuanji A3," which has now entered mass production. The chip supports L3 and L4 autonomous driving, with a total computing power exceeding 2100 TOPS across three chips. It is reported that the chip, combined with BYD's self-developed algorithms and deep optimization, has achieved a 100% improvement in computing power utilization. The launch of this self-developed intelligent driving chip signifies that BYD has achieved full-chain control over its advanced driver-assistance systems, realizing deep integration of hardware and software.

He outlined the foundational strengths behind BYD's intelligent driving chip development: a chip research and development team of over 7,000 engineers, an accumulated investment exceeding 100 billion yuan in chips, four major chip R&D bases, and five wafer fabrication plants. BYD masters all seven key steps from product definition, architecture design, and circuit design to wafer manufacturing, packaging, and testing, making it the only global automaker with full-process, end-to-end chip manufacturing capabilities.