The Information, citing two people familiar with the project, reports TSMC is developing an advanced chip-packaging technology similar to Intel's Embedded Multi-die Interconnect Bridge (EMIB).

With AI driving demand to integrate more processors and high-bandwidth memory into larger multi-die packages, advanced packaging has emerged as a key industry bottleneck. Intel’s EMIB uses small silicon bridges to create high-speed links between processors and memory, enabling larger multi-chip AI designs and helping customers diversify supply chains; it has attracted interest from NVIDIA .

Sources say TSMC engineers internally call the work “EMIB-like” and have discussed the solution with some customers.